M29W128GL70ZS6E找美光上深圳市美光存储技术
Manufacturer Part Number:
M29W128GL70ZS6E
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Ihs Manufacturer:
MICRON TECHNOLOGY INC
Part Package Code:
BGA
Package Description:
LBGA, BGA64,8X8,40
Pin Count:
64
Reach Compliance Code:
compliant
ECCN Code:
EAR99
HTS Code:
8542.32.00.51
Manufacturer:
Micron Technology Inc
Risk Rank:
5.37
Access Time-Max:
70 ns
Alternate Memory Width:
8
Command User Interface:
YES
Common Flash Interface:
YES
Data Polling:
YES
JESD-30 Code:
R-PBGA-B64
JESD-609 Code:
e1
Length:
13 mm
Memory Density:
131072 bit
Memory IC Type:
FLASH
Memory Width:
16
Number of Functions:
1
Number of Sectors/Size:
128
Number of Terminals:
64
Number of Words:
8192 words
Number of Words Code:
8000
Operating Mode:
ASYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Organization:
8KX16
Package Body Material:
PLASTIC/EPOXY
Package Code:
LBGA
Package Equivalence Code:
BGA64,8X8,40
Package Shape:
RECTANGULAR
Package Style:
GRID ARRAY, LOW PROFILE
Page Size:
8/16 words
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
260
Power Supplies:
3/3.3 V
Programming Voltage:
3 V
Qualification Status:
Not Qualified
Ready/Busy:
YES
Seated Height-Max:
1.4 mm
Sector Size:
128K
Standby Current-Max:
0.0001 A
Subcategory:
Flash Memories
Supply Current-Max:
0.02 mA
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
2.7 V
Supply Voltage-Nom (Vsup):
3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
TIN SILVER COPPER
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@peak Reflow Temperature-Max (s):
30
Toggle Bit:
YES
Type:
NOR TYPE
Width:
11 mm
深圳市美光存储技术专注：XILINX,SAMSUNG,HYNIX.INTEL.ALTERA,MICRON,MAXIM,ADI,TI,ST,NXP.
Manufacturer Part Number:
M29W128GL70ZS6E
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Ihs Manufacturer:
MICRON TECHNOLOGY INC
Part Package Code:
BGA
Package Description:
LBGA, BGA64,8X8,40
Pin Count:
64
Reach Compliance Code:
compliant
ECCN Code:
EAR99
HTS Code:
8542.32.00.51
Manufacturer:
Micron Technology Inc
Risk Rank:
5.37
Access Time-Max:
70 ns
Alternate Memory Width:
8
Command User Interface:
YES
Common Flash Interface:
YES
Data Polling:
YES
JESD-30 Code:
R-PBGA-B64
JESD-609 Code:
e1
Length:
13 mm
Memory Density:
131072 bit
Memory IC Type:
FLASH
Memory Width:
16
Number of Functions:
1
Number of Sectors/Size:
128
Number of Terminals:
64
Number of Words:
8192 words
Number of Words Code:
8000
Operating Mode:
ASYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Organization:
8KX16
Package Body Material:
PLASTIC/EPOXY
Package Code:
LBGA
Package Equivalence Code:
BGA64,8X8,40
Package Shape:
RECTANGULAR
Package Style:
GRID ARRAY, LOW PROFILE
Page Size:
8/16 words
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
260
Power Supplies:
3/3.3 V
Programming Voltage:
3 V
Qualification Status:
Not Qualified
Ready/Busy:
YES
Seated Height-Max:
1.4 mm
Sector Size:
128K
Standby Current-Max:
0.0001 A
Subcategory:
Flash Memories
Supply Current-Max:
0.02 mA
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
2.7 V
Supply Voltage-Nom (Vsup):
3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
TIN SILVER COPPER
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@peak Reflow Temperature-Max (s):
30
Toggle Bit:
YES
Type:
NOR TYPE
Width:
11 mm
深圳市美光存储技术专注：XILINX,SAMSUNG,HYNIX.INTEL.ALTERA,MICRON,MAXIM,ADI,TI,ST,NXP.
